Industries & applications

Liquid cooling
in context.

Explore component-selection requirements across high-density computing, data centers, energy storage and power electronics.

High-density cooling application context — illustrative concept
Illustrative concept · not a product specification or project photograph

01

AI & HPC

High-density computing equipment and infrastructure as a requirements context.

02

Data Centers

Data-center equipment and rack cooling as a procurement context.

03

Energy Storage

Fluid-component requirements for energy-storage equipment, including routing, connections and service access.

04

Power Electronics

Fluid-component requirements around power-electronics equipment, including mounting, interfaces and operating conditions.

Component-level requirements

Explore loop applications.

01

Server-to-Rack Liquid Loop

Connection and conveyance between equipment cooling components and rack distribution.

03

CDU / Secondary Loop

Hoses, fittings, valves and supporting assemblies at the rack-to-secondary-loop connection.

04

Blind-Mate Serviceable Racks

Rack architectures where controlled alignment supports equipment installation and service.

05

Cold-Plate Loop Integration

Requirements connecting application-specific cold plates to the surrounding component loop.